CHIPS for America to invest up to $1.6 billion to accelerate U.S. capacity advanced packaging

The U.S. Department of Commerce recently issued a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities to accelerate domestic capacity for semiconductor advanced packaging.​ As part of CHIPS for America, the National Advanced Packaging Manufacturing Program plans to invest up to $1.6 billion to fund innovation in five R&D areas related to semiconductor advanced packaging. ​

The program anticipates making several awards of approximately $150 million in each research area. ​Private sector investments from industry and academia are expected. ​The five R&D areas are

• Equipment, tools, processes, and process integration
• Power delivery and thermal management
• Connector technology, including photonics and radio frequency (RF)
• Chiplets ecosystem (small, modular integrated circuits that perform specific functions)
• Co-design/electronic design automation (EDA). 

The funding opportunity is also expected to include opportunities for prototype developments.

According to CHIPS for America, advanced packaging is crucial for advancements in semiconductor technology. It will allow manufacturers to improve system performance, function, time to market, physical footprint, power consumption, and cost reduction. ​The National Advanced Packaging Manufacturing Program’s goal is to create a domestic packaging industry that leads in innovation and enables the packaging of advanced node chips within the United States. More information about the NOI will be shared in an upcoming webinar. Sign up here for updates.