NY announces $1B for semiconductor R&D center; U.S. Department of Commerce awards $35M as first step in implementation phase of CHIPS and Science
Activity to build the U.S. semiconductor industry picked up steam on Monday, December 11. On that day, New York State, Gov.
Defense makes $238M CHIPS and Science Act awards for eight microelectronics regional innovation hubs
The Department of Defense announced yesterday that it issued $238 million from "Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act" funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs. With $2 billion in funding for Fiscal Years 2023 through 2027, the Microelectronics Commons program aims to leverage these hubs to accelerate domestic hardware prototyping and "lab-to-fab" transition of semiconductor technologies.
CHIPS announcements include a $285M to establish SMART USA Institute, incentives with TSMC Arizona, and $300M for semiconductor packaging R&D
CHIPS for America recently announced $285 million to establish the Semiconductor Manufacturing and Advanced Research with Twins (SMART) USA Institute, which will focus on semiconductor manufacturing and advanced packaging.
Site selection process for first three CHIPS R&D facilities revealed
The U.S. Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), recently announced the site selection process for the first three CHIPS for America Research and Development (R&D) facilities for the NSTC and National Advanced Packaging Manufacturing Program (NAPMP).