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The U.S. Department of Commerce recently issued a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities to accelerate domestic capacity for semiconductor advanced packaging.​ As part of CHIPS for America, the National Advanced Packaging Manufacturing Program plans to invest up to $1.6 billion to fund innovation in five R&D areas related to semiconductor advanced packaging. ​

The inaugural Manufacturing Momentum Summit is an opportunity for federal, state, regional, and local leaders to share their efforts to prepare the workforce required for the advanced defense manufacturing supply chain. Held in conjunction with several partners, including the DoD Manufacturing Technology Program, the Center for Regional Economic Competitiveness, and the American Manufacturing Communities Collaborative, the Summit will be held from September 12 - 14, 2023, in Arlington, VA.

Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio recently revealed in public comments that approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging.

The challenge of attracting and retaining skilled manufacturing talent consistently ranks as a top concern in the industry. Recent findings from the National Association of Manufacturers (NAM) show that more than 70% of industry leaders cite workforce issues as their primary challenge for the past year, outpacing supply chain disruptions and rising raw material costs.

Additive manufacturing, also known as 3D printing, has so far been used for simple construction. In this process, a computer creates three-dimensional objects by depositing materials, usually in layers. But now, the National Institute for Standards in Technology (NIST) is working to unlock additive manufacturing’s potential.

The National Science Foundation (NSF) is expanding a network of research centers across the country to translate university-based R&D into new, and hopefully, better advanced materials. In late June, NSF announced the distribution of $162 million to support the creation of nine more Materials Research Science & Engineering Centers (MRSECs), bringing the total number of centers to twenty. Each of the new centers will receive $18 million over six years.