Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio recently revealed in public comments that approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging.
The CHIPS and Science Act (Act) established guardrails to prevent funding recipients from using the money to support the development of semiconductor manufacturing and technology in foreign countries of concern, including North Korea, China, Russia, and Iran. On September 25, 2023, the CHIPS Program Office CPO published the final rules for preventing improper use of CHIPS Act funding.
Just before the 2023 Memorial Day weekend, the Texas Senate passed and sent the Texas CHIPS Act bill to the governor’s desk. The legislation creates the Texas Semiconductor Innovation Consortium in a bid to protect the state’s competitive standing for future federal funding and authorizes the Texas Semiconductor Innovation Fund. The recently passed Texas budget appropriates $1.3 million for the Consortium, but it does not appear that there is a dedicated appropriation in the budget bill for the Fund.
Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio announced five leaders joining the CHIPS Research and Development Office within CHIPS for America.
The National Institute of Standards of Technology (NIST) is seeking public input through Requests for Information (RFIs) for two programs under the CHIPS Act. Under Secretary of Commerce for Standards and Technology and NIST Director Laurie E.
The vision and strategy for a National Semiconductor Technology Center (NSTC), a key part of the R&D program set out in the CHIPS and Science Act, was released this week by the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST).
A recent report outlines over 100 initiatives that could boost the semiconductor industry. The Arizona Commerce Authority and Boston Consulting Group recently collaborated on a National Semiconductor Economic Roadmap (NSER) to advance semiconductor competitiveness in the United States.
This week, the U.S. Department of Commerce updated its timeline for funding opportunities that support semiconductor and related manufacturing, as well as relevant R&D facilities. The department still intends, as first stated in its strategic plan last fall, to make funding for chip fabrication facilities available later this month.
The Commerce Department has suspended plans to announce a funding opportunity for the construction, modernization, or expansion of commercial semiconductor R&D facilities, according to an announcement the CHIPS Program Office made in their newsletter last week. The suspension does not impact the $11 billion the CHIPS Program Office still plans to spend on semiconductor R&D through separate R&D programs, nor does it affect the awards for incentive program funding opportunities already announced.
The U.S. Department of Commerce has recently signed two non-binding preliminary memorandums of terms (PMTs) with semiconductor companies to provide direct funding under the CHIPS and Science Act. One company, the TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), will receive up to $6.6 billion to support the company’s investment of more than $65 billion in three greenfield fabs in Phoenix, Arizona.
The White House announced on February 9 that the administration expects to invest over $5 billion in semiconductor-related research, development, and workforce needs. The $5 billion will flow through the National Semiconductor Technology Center (NSTC), a public-private entity created to handle the funds. Friday’s announcement established the NSTC as a public-private consortium of the Secretaries of Commerce, Defense, and Energy, the Director of the National Science Foundation, and Natcast.
An independent selection committee recently announced the incoming board of trustees that are expected to oversee a nonprofit entity that
The U.S. Department of Commerce recently issued a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities to accelerate domestic capacity for semiconductor advanced packaging. As part of CHIPS for America, the National Advanced Packaging Manufacturing Program plans to invest up to $1.6 billion to fund innovation in five R&D areas related to semiconductor advanced packaging.
Three pieces of federal legislation enacted in 2021 and 2022—the Infrastructure Investment and Jobs Act (IIJA), CHIPS and Science Act (CHIPS Act), and Inflation Reduction Act (IRA)—collectively authorize nearly $1.5 trillion to reshape America’s industrial landscape. But will this money help the 107 Black-owned and 151 Hispanic-owned companies in the manufacturing supply chains that the legislation is designed to support?
The National Institute of Standards and Technology (NIST) has issued a Notice of Funding Opportunity (NOFO) seeking proposals to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. The CHIPS for America Program anticipates up to approximately $285 million in funding will be awarded to the institute.
The recently-passed CHIPS and Science Act included $54.2 billion in appropriations, largely for semiconductor manufacturing incentives ($39 billion) and R&D ($11 billion). The administration is releasing information about its planned distribution of funds. Recent resources include: a strategic plan from the U.S.
With President Biden’s signing the CHIPS and Science Act on Aug. 9, states and universities are already making plans to build on the funding opportunities present in the legislation.
On Wednesday, a bipartisan group of senators published Driving U.S. Innovation in Artificial Intelligence: A Roadmap for Artificial Intelligence Policy in the United States Senate. The roadmap encourages the executive branch and the Senate Appropriations Committee to reach the $32 billion per year non-defense AI innovation spending level proposed by the National Security Commission on Artificial Intelligence.
The National Science Foundation announced 16 finalists for the first-ever NSF Regional Innovation Engines (NSF Engines) competition, spanning a range of key technology areas and societal and economic challenges highlighted in the "CHIPS and Science Act." The NSF Engines will link up with local and regional partners to expand innovation nationwide and create collaborative and inclusive technology-driven innovation ecosystems.
The lead organizations for the 16 teams are:
Arizona State University
Current Innovation, NFP (IL)
FUZEHUB, Inc. (NY)
NATCAST, the operator of the National Semiconductor Technology Center (NSTC) tasked with bolstering the United States' semiconductor industry, announced Albany NY and Sunnyvale CA as the locations for two major R&D facilities. The funding comes from the CHIPS and Science Act of 2022, legislation aimed at revitalizing American semiconductor manufacturing and research.