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NIST reveals plan for boosting U.S. advanced packaging capabilities for semiconductors
Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio recently revealed in public comments that approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging.
3D printing could catapult US manufacturing
Additive manufacturing, also known as 3D printing, has so far been used for simple construction. In this process, a computer creates three-dimensional objects by depositing materials, usually in layers. But now, the National Institute for Standards in Technology (NIST) is working to unlock additive manufacturing’s potential.